Zu "Hybrid bonding" wurden 4 Produkte gefunden
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
181,89 €*
Preise inkl. MwSt. zzgl. Versandkosten
Chiplet Design and Heterogeneous Integration Packaging
139,09 €*
Preise inkl. MwSt. zzgl. Versandkosten
Chiplet Design and Heterogeneous Integration Packaging
192,59 €*
Preise inkl. MwSt. zzgl. Versandkosten
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
192,59 €*
Preise inkl. MwSt. zzgl. Versandkosten