Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
Produktnummer:
1812aa670d633540a3b51bf6c82908d626
| Autor: | Lau, John H. |
|---|---|
| Themengebiete: | 2.1D, 2.3D, and 3D IC integration Bridges Chiplet lateral communications Chip partitioning Chip splitting Chitlet design Hybrid bonding Multiple system and heterogenous integration Redistribution-layer Through-silicon via |
| Veröffentlichungsdatum: | 29.03.2024 |
| EAN: | 9789811999192 |
| Sprache: | Englisch |
| Seitenzahl: | 525 |
| Produktart: | Kartoniert / Broschiert |
| Verlag: | Springer Singapore |
Produktinformationen "Chiplet Design and Heterogeneous Integration Packaging"
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Sie möchten lieber vor Ort einkaufen?
Sie haben Fragen zu diesem oder anderen Produkten oder möchten einfach gerne analog im Laden stöbern? Wir sind gerne für Sie da und beraten Sie auch telefonisch.
Juristische Fachbuchhandlung
Georg Blendl
Parcellistraße 5 (Maxburg)
8033 München
Montag - Freitag: 8:15 -18 Uhr
Samstags geschlossen