Three Dimensional System Integration
Produktnummer:
18b2c8b2593804437495e5a26fa8c36152
| Themengebiete: | 3D Chip Stacking 3D Integrated Circuit Design and Manufacturing 3D Integrated Circuits 3D Stacked Integrated Circuits 3D System Integration Contactless 3D Coupling DRAM Stacking Logic Stacking TSV Through-Silicon Vias |
|---|---|
| Veröffentlichungsdatum: | 15.12.2010 |
| EAN: | 9781441909619 |
| Sprache: | Englisch |
| Seitenzahl: | 246 |
| Produktart: | Gebunden |
| Herausgeber: | Papanikolaou, Antonis Radojcic, Riko Soudris, Dimitrios |
| Verlag: | Springer US |
| Untertitel: | IC Stacking Process and Design |
Produktinformationen "Three Dimensional System Integration"
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
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