Reliability of Microtechnology
Liu, Johan, Salmela, Olli, Sarkka, Jussi, Morris, James E., Tegehall, Per-Erik, Andersson, Cristina
Produktnummer:
1851b21455e3494363b5464331fee8a609
| Autor: | Andersson, Cristina Liu, Johan Morris, James E. Salmela, Olli Sarkka, Jussi Tegehall, Per-Erik |
|---|---|
| Themengebiete: | Electrical conductive adhesives Failure mechanisms of microsystems Interconnection reliability Microsystems Reliability for manufacturability Reliability metrology Reliability of microsystems Solder joints System level reliability Thermal fatigue |
| Veröffentlichungsdatum: | 14.02.2011 |
| EAN: | 9781441957597 |
| Sprache: | Englisch |
| Seitenzahl: | 204 |
| Produktart: | Gebunden |
| Verlag: | Springer US |
| Untertitel: | Interconnects, Devices and Systems |
Produktinformationen "Reliability of Microtechnology"
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.
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