Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
| Themengebiete: | Bau / Entwurf, Konstruktion Elektronik / Mikroelektronik Festkörperphysik Mikroelektronik Mikroskopie Optik Spektroskopie |
|---|---|
| Veröffentlichungsdatum: | 29.05.2007 |
| EAN: | 9780387279749 |
| Sprache: | Englisch |
| Seitenzahl: | 1528 |
| Produktart: | Gebunden |
| Herausgeber: | Lee, Y. C. Suhir, Ephraim Wong, C. P. |
| Verlag: | Springer Springer US, New York, N.Y. |
| Untertitel: | Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging |
Produktinformationen "Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging"
This handbook is the first comprehensive reference to collect and present up-to-date, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and gives practical recommendations on how to successfully apply current knowledge in this field. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product. The handbook can be as a manual for self-education. It is an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging, and reliability, with an emphasis on physical design problems, challenges, and solutions.
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