Integrated Circuit Packaging, Assembly and Interconnections
Greig, William
Produktnummer:
18c8985e9ac310495a8d58a9fa28df4950
| Autor: | Greig, William |
|---|---|
| Themengebiete: | circuit integrated circuit manufacturing material packaging thin films |
| Veröffentlichungsdatum: | 29.10.2010 |
| EAN: | 9781441939234 |
| Sprache: | Englisch |
| Seitenzahl: | 300 |
| Produktart: | Kartoniert / Broschiert |
| Verlag: | Springer US |
Produktinformationen "Integrated Circuit Packaging, Assembly and Interconnections"
Reviewing various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book details available packaging approaches: single chip, multichip, and Chip On Board; the assembly options, chip and wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.
Sie möchten lieber vor Ort einkaufen?
Sie haben Fragen zu diesem oder anderen Produkten oder möchten einfach gerne analog im Laden stöbern? Wir sind gerne für Sie da und beraten Sie auch telefonisch.
Juristische Fachbuchhandlung
Georg Blendl
Parcellistraße 5 (Maxburg)
8033 München
Montag - Freitag: 8:15 -18 Uhr
Samstags geschlossen