Enterprise Interoperability X
Produktnummer:
180b1ceb4169d24f3a93e0599eec7a4433
Themengebiete: | Collaborative Platforms Collaborative Supply Chains Conference Proceedings Digital Twins Enterprise Interoperability Enterprise Social Networks Industry 4.0 Ontological Interoperability Open Standards Semantic Interoperability |
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Veröffentlichungsdatum: | 21.03.2024 |
EAN: | 9783031247705 |
Sprache: | Englisch |
Seitenzahl: | 314 |
Produktart: | Gebunden |
Herausgeber: | Ducq, Yves Leon, Ramona-Diana Rodríguez-Rodríguez, Raúl Romero, David |
Verlag: | Springer International Publishing |
Untertitel: | Enterprise Interoperability Through Connected Digital Twins |
Produktinformationen "Enterprise Interoperability X"
Enterprise Interoperability X presents contributions ranging from academic research and case studies, to industrial and administrative experiences with interoperability. These contributions help organizations to analyse and improve their products and processes in the face of the high degree of uncertainty in the current commercial environment, and to predict their performance. To this end, the contributors exploit digital twin technology that integrates tools from the Internet of Things, artificial intelligence and software analytics. Enterprise interoperability necessarily arises from the processes required to make associated digital twins work together. The book forms the proceedings of the I-ESA’22 Conference, which was organised by the Universidad Politécnica de Valencia, on behalf of INTERVAL and the European Virtual Laboratory for Enterprise Interoperability (INTEROP-VLab), and was held in Valencia, Spain in March 2022. Many of the papers in this eleventh volume ofthe Proceedings of the I-ESA Conferences include examples and illustrations to help deepen readers’ understanding and generate new ideas. Offering a detailed guide to the state of the art in systems interoperability, the book will be of great value to all engineers and computer scientists working in manufacturing and other process industries, and to software engineers and electronic and manufacturing engineers working in academic settings.

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