Electronic Equipment Packaging Technology
Ginsberg, Gerald L.
Produktnummer:
180a87343e2d404f31a26e3353ecad84d4
Autor: | Ginsberg, Gerald L. |
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Themengebiete: | assembly base development electron electronics heat structure |
Veröffentlichungsdatum: | 27.02.1992 |
EAN: | 9780442238186 |
Sprache: | Englisch |
Seitenzahl: | 279 |
Produktart: | Gebunden |
Verlag: | Springer US |
Produktinformationen "Electronic Equipment Packaging Technology"
The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

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