3D Microelectronic Packaging
Produktnummer:
180165c5176f98413e87f835c4dd9afbaa
| Themengebiete: | 3D microelectronic packages Advanced materials in 3D packages Failure analysis microelectronic packaging Heat dissipation Metallic and polymeric packaging materials Micro bumps Quality and Reliability of 3D Packaging Solder connects in 3D packages TSV Processing and Reliability Through-silicon via |
|---|---|
| Veröffentlichungsdatum: | 13.07.2018 |
| EAN: | 9783319830865 |
| Sprache: | Englisch |
| Seitenzahl: | 463 |
| Produktart: | Kartoniert / Broschiert |
| Herausgeber: | Goyal, Deepak Li, Yan |
| Verlag: | Springer International Publishing |
| Untertitel: | From Fundamentals to Applications |
Produktinformationen "3D Microelectronic Packaging"
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
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